BARE DIE ASSEMBLY Dicing Die Sorting Dispensing & Die attach Curing & Reflow Oven Vacuum Reflow Soldering Wire Bonding Pull/shear test
FOR NEAR FIELD MEASURMENT Electromagnetic field active compensation Active vibration table Microscope and accessories
SMART CARDS/TICKETS/LABELS Inlay manufacturing by wire embedded and strap attached Milling and Implanting Converting  Lamination Manufacturing tickets and labels integrating electonic antenna
SMD ELECTRONIC ASSEMBLY Software Solution for SMD Shop Floor
AUTOMATIC WAFER’S HANDLING Packing / Unpacking of wafers to / from compact transport canisters Wafer Sorting Wafer Transfer Tool Automatic Thin Wafer’s Handling with Bernoulli principle End-Effectors Subsystems for Thin Wafer’s Handling : Cassettes 3D Scanners, Automatic Exchangers & Cleaners of End-Effectors, Pre-aligners and special Robots Integration of Metrology Systems into the automatic wafer handlers
METROLOGY FOR SEMICONDUCTORS Automatic Measurement of Thin Films Thickness by Spectral Reflectance Automatic Defects Inspection of Wafers and photolithography Mask Blanks Integration of Metrology Systems into the automatic wafer handlers
THIN FILMS VACUUM COATING FOR PRECISION OPTICS, OPHTHALMIC & SEMICONDUCTORS Evaporation equipments for PVD vacuum coating with heated boats, E-beams and ionic assistance Evaporation equipments with Plasma assistance for RF PEPVD vacuum coating with heated boats and E-beams Equipments for Thin Films deposition by Sputtering under vacuum Refurbishing and modernization of existing vacuum coating equipments
SOLUTIONS FOR CLEAN AIR ENVIRONMENT Modular clean-room Systems Clean Environment Transportable Cabin Micro Clean-rooms Clean Air Workbenches Mini-Environments Clean air Transport and Storage cabinets Fan Filter Modules Clean-room compatible Sealant Testing for clean-room suitability and cleanliness Parts cleaning and packaging in clean-room conditions Consultancy, constructional design coaching, development of specific customer solutions
PHOTOVOLTAIC MODULES ASSEMBLY SOLUTIONS Single opening laminators for production & for laboratory Multi openings laminators for production & for laboratory Wet coating systems Foil cutting, layup & back sheet pairing Turnkey back-end lines for thin film modules Conductive glue drying PV modules handling systems PV modules sorting Flex modules coating & lamination line
OTHER EQUIPMENTS AND TECHNOLOGIES OF OUR FRONT-END & ADVANCED TECHNOLOGIES DEPARTMENT Laser Ablation / Etching / Cutting for precision applications Innovative solutions development for high-tech applications Numerical images processing systems 2D & 3D Optical Inspection with Laser image processing Packages sealing by electrical Seam welding and Projection welding